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The triggering of the establishment of the high density packaging technical section was "High Density Packaging Technology Visiting the United States Actual Condition Survey Group" in North America, which was implemented in October, 1984.

The purpose of the investigation was that at the time, the switch over from "through hole mount technology" to "surface-mount " was about to begin. They were to go to America, who had keep proceeding with "surface-mount technology", to grasp the actual condition.

Participants were companied of 13 companies and 14 members and in 2 week period, (1984.10.13.-10.27.), the trip consisted of traveling a long distance of as for north as Boston to as far south as Orlando, Florida.

Two extremely meaningful weeks were spent, where several manufacturing companies of the material and parts were visited, including DuPont. It consisted of a factory tour and an exchanging of views with the technical experts, where valuable packaging information of the latest technology was obtained.

The togetherness was born in crossing and doing sleeping and eating together by the implementing relation technical expert who didn't have acquaintance at all to 2 weeks in the saying of implementing related information getting as the result in the North American investigation.
The opinion agreed about saying that would make the place which the togetherness which was born specially in the supper which went in Boston in the home-returning previous day can be maintained in Japan by all means to it and be expanded into.
 
Photograph 1: (1984 at Boston) High Density Packaging Technology Visiting the United States Actual Condition Survey Group that the beginning "High Density Package Technical Committee"
 
A committee was started in the appeal of Honda Tatsuo (the first high density packaging technical section length ) in Matsushita Electronic Components when he served as the head in the probe squad after returning home for a while.
This committee was the one to make the place for the activity that makes it possible to attempt an exchange between creating and sharing information transmission about the technology between the technical experts. An establishment arrangement committee was started at the Matsushita Electronic Components Tokyo office in Onarimon.

About once as the committee, the member which can gather every time the was implementing several times the deliberation to exchange about the alcohol of the number, too, about the group management form and the name and the person in charge and so on from the evening to 2 months in Onarimon where there is Honda.

It fixed the establishment of "High Density Package Technical Committee" as the inside of "Japan Jisso Technology Transfer Association"(JJTTA) which was sponsorship probe squad original in the autumn in 1986.
It started as the place where the first regular section can do the communication of the implementing industry literally by commemorating high density packaging technical section establishment in January, 1987 of the next year and implementing a special lecture.

The first High Density Package Technical Committee set sail, as shown in table, when it was hosted by two special lectures.
 
Table 1:  The special lecture contents of establishment of the High Density Package Technical Committee.
 1. About SMT
   Mr. Tatsuo Honda, Matsushita Electronic Components
 2. Bio-electronics 
   Professor Yukio Karube、 Tokyo Institute of Technology
 
This meeting started and with the hosting of a meeting once every two months and its 10th meeting had been reached by July 1988, and by July 1989 its first overseas seminar had occurred in Singapore.

Next, at the same time of the 2nd hosting of the special seminar in Singapore in November 1990, a visit to Singapore and Malaysia was implemented to communicate about the packaging technology by each company.

In February, 1991, the first showing (hosting in YHP) by the company occurred, and it become an activity to comply with the participants' wishes.
 
Photograph 2: The Singapore implementing symposium
(Left: Symposium Place・Singapore /1989 Right: DuPont・Singapore/1990)
 
The consideration of committee chairman Honda, and his response to the needs of the participants who appeared at the meetings steadily increased membership.

Since then, in December, 1991, it implements a second showing and a lecture at Kyushu Matsushita Electric and in October, 1992, it visited Hayashibara for it 3rd showing, and then to Matsushita-Kotobuki Electronics Ind., for its 4th in October, 1993.

The regular section didn't stay in merely lecture and was the importance of the human resource network which does a communication with the person who was made acquaintance as the tendency in case of being started.

It was a problem by how to embody this in the regular section.
By the concept that will provide the atmosphere which can make to surround the lecturer to have lectured after a lecture was ended and a communication casually, it hosted the party of the buffet form.
This " the technology exchange meeting " is hosted and becomes an offer in the place of the talk of the place and the lecturer who exchanges a business card.

This becomes the feature of the High Density Package Technical Committee and its form has been continued into present.
 
Photograph 3: Venue scenery of the regular section
Photograph 4: A snap of the technology exchange meeting
 
This place is open widly not only the members, but also to the mass communication person as well, and has been a site of communication.

Also, the feature lies in the point to fix lecture contents in the deliberation form in Committee of Rules which is composed of the several management member of the committee about the management and to be managed, choosing a timely theme, too.

It publishes an after and a manuscript collection and the lecture material of the regular section which was implemented to 1 year as shown in the photograph is attempting to be temporary to the member, too.
 
Photograph 5: High Density Package Technical Committee material
 
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